Apparently "min annular ring" is applied to the surface layers and
"drill to copper distance" is applied to inner layers.
Their literal quote:
Comment: When a plated hole is too close to copper features
the plated hole may short to the copper feature. The plated
hole to copper feature minimum requirement for this product
is 9.800 mils. This location measures 5.000 mils.
I would have interpreted that to mean 'don't get wires too close to
holes' but of the subset of the errors which are illustrated, it's
just the copper around the hole.
On the other hand it could just indicate an error in their DRC that's
interpreting the negative layer wrong at that step. Eg for thermalled
vias, it's showing an error where there's thermal relief...
--
Ben Jackson AD7GD
<[EMAIL PROTECTED]>
http://www.ben.com/
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