I am also interested in why you would want a thermal for connecting a via onto a pad in which the via is sitting.
I have used vias in pads twice now. 1) High density bga with a minimal number of layers. number of layers is no longer an issue with pcb. 2) Conducting heat away from a component and into a power or ground layer. For this case a thermal would be counter productive. Steve Meier DJ Delorie wrote: > pcb doesn't support thermals on pads. > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > > _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user