First, I'd like to say thanks to all for their input and patience on this list - especially towards the new users. I've moved to PCB since it is open and I'm tired of having to leave designs behind because I've changed positions and locations and no longer have access to the layout package I was working with last. The user-list has saved me more than once from my selective blindness when it comes to reading the documentation!
Now, the question: I've observed two different techniques for tying analog and digital ground planes on mixed-signal boards. The first technique placed the tie-in directly under the analog/digital converter on the MCU, the second technique placed the tie-in at the far edge of the board between the analog and digital connectors. Both boards were MCU development boards, laid out so that roughly one quadrant of the board was analog, the rest digital. I've got all of my components placed and ready to go, just wondering what experience/thoughts the user-list had on the subject. Regards, Ethan _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user