Ethan Swint wrote: > Steve Underwood wrote: > >> away the surplus solder in seconds. Creating a huge continuous blob of >> solder around the four side is the strategy for removing a QFP. >> >> > The way I like to remove QFPs (assuming that they're dead) is with a bit > of bare AWG30 behind the pins. Run the wire between pins and package, > anchor one end through a via, pull on the free end and the chip will > 'unzip' as you move down the edge with a big iron. > That way gives you a high risk of pulling pads off the board, and really messes up the pins. You don't want to apply *any* avoidable mechanical load on those pads. Heat the pins until they really come free. If you want to reuse the chip (say for analysis - you'd only really *want* to reuse it in desperate circumstances) you really want to keep its legs as nesr intact as possible. The big solder blob approach is good for that.
Stev _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user