Can anybody point me to guidelines for the solder mask clearances used for SMD devices?� I haven't been able to find it mentioned in device spec sheets or in the manufacturer capability specs from places like batchPCB.com, PCBexpress, etc...� From what I have read, it seems like 'a few thou' is good.� Just to be sure, this is a few thou between the edge of the pad/pin and the solder mask?� Does anybody with experience have a good recommended value that they know works well for devices that have pads with 35 thou (0.035") between the edges of the pad? I was thinking of going with 3 thou (0.003") for my solder mask. Thanks a bunch! ~Luke
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