I've been working on a number of QFN packages recently (for example the ATMEGA664). The package has a large central ground pad, and 44 small pads around the outside.
There is a known problem in layouts with vias inside pads, where solder wicks down into vias and causes the joint to be poorly soldered. I found this link about how to avoid this problem: http://blog.screamingcircuits.com/2007/04/soldermask_via_.html Although I could change the footprint to have holes in the central pad, then put the vias into them, this requires that I know the drill technology at the time as I specify the footprint. Is there a way to edit the solder mask after parts have been placed onto the pcb? Or a better way to do this entirely? -- ╒═════════════════════════════════════════════╕ Andrew Whyte paramita ltd ╘═════════════════════════════════════════════╛ _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user