Ignore the past and you will fail Ignore the future and you have already failed. ----- Original Message ----- From: "John Richard Smith" <[EMAIL PROTECTED]> To: "NEWBIE 1" <[EMAIL PROTECTED]> Sent: Tuesday, February 03, 2004 07:45 Subject: [newbie] CPU temperatures and cooling issues + memory
> CPU temperatures and cooling issues+ memory > =========================================== > > I decided to start this thread again. > The precious thread had become a bit rambling. > > Well, > > My cpu / heatsink and case temperatures are still > regarded by the techies at AMD as withing tollerances. > I am not happy with the conclusion though. > > These are:-- > > Case temp 28C with CPU temp of 49/50C on normal desktop loads. > Case temp 28/32C CPU temp of 56.5 on 99% Loads (and siezure) > > I am not happy with these temps. > I would like to see case temps of 28C constant > and cpu temps of low 40's rising to middle/upper > 40's under full load scenarios. > > I already have to 8cm case fans ,in at front, out at back. > > > I feel , rightly or wrongly, that my real problem > is the heat sink itself which is of all alluminium > construction, and/or the bedding of the heatsink > to the cpu.I have already tried rebedding the heat > sink. Incdentally AMD did not recommend the compund > bedding matterial at all, and recommended the patch > method. I must say that has not been my experience > to date. I have always had best results with a thin > screed of compound. I wonder what other folks > experiences are. > Alluminium is a worse heat conductor than copper and gold is even better. I would suggest you get in touch with the people who make heat sinks they would be better able to advise you. > I feel my current heatsink fails to transfer > the generated cpu heat to the veins and the airflow > fast enough. That may be due to the method of bedding Contact is the most important, the bedding is used to insure that the heat sink is in firm contact with the heat generator. Air flow across the heat sink is VERY important. > but I am fast loosing confidence in that conclusion. > I suspect the alluminium block itself is not as good > a conducter of heat as I really need for my 1800 > athlon cpu. I wonder whether those of you with > experience of coper heatsinks can report your > experiences, are they that much better than > alluminium heatsinks ? I would really like to > know. I am prepared to buy a new coper heatsink > if they prove really worthwhile. > > I have tried to find out which manufacturer made > my stick of memory without success. All I can find > out is what I can read on the stick itself:- > SANSUNG 151 K4H560838C-TCB0 > BCJ165XX KOREA > Samsung Korea 0152 > M368L6423CTL-CB0 512MB DDR PC2100 > > I have tried to find out if Samsung have a > chip plant in Korea. I still donn't know. > It could be made from samsung chips in > a plant not owned by samsung in korea.In > which case maybe not so good. But Samsung > in general I though made good quality chips ? > > Anyway that is all I know to date. > Not an expert. Hope these notes help. Regards; Hoyt
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