Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-23 Thread Steve Meier
Dave, PCBExpress requirement of a clearence around the pads of at least 8 mills meets the IPC specifications for silk screened soldermask. For the geometry of the TSSOP-20 with a lead pitch of 26 mills and lead widths of 10 Mills your soldermask width between pads would be zero. As you stated. I

Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-22 Thread Dave N6NZ
That's interesting information, thanks. I'm thinking I misintrepreted "mask swell" to mean .008 copper-to-mask, as opposed to mask diamater = pad diameter + 0.008, which would yield .004 mask-to-copper. If so, then I end up with .008 of mask between pads. In any case, I need to verify with t

Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-22 Thread Steve Meier
One shop I work with asks for soldermasks to be at least 5 mills wide. If you have two adjacent pads with solder mask between the pads that soldermask should be at least 5 mills wide. So I suspect for PCBexpress that they need the soldermask to be at least 8mills wide. The issues has to do with ali

Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-21 Thread Dave N6NZ
Thanks, very helpful. That seems like the correct interpretation of their use of the word "swell". -dave DJ Delorie wrote: Below a certain pitch, mask becomes almost useless, because the solder will bride from pin to pin anyway. The challenge boards are 0.50m and 0.40mm pitch and neither ha

Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-21 Thread DJ Delorie
Below a certain pitch, mask becomes almost useless, because the solder will bride from pin to pin anyway. The challenge boards are 0.50m and 0.40mm pitch and neither has mask between the pins. What seems to work for me is to just glob on the solder, then go over it with a desolder braid where ne

Re: gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-21 Thread Dave N6NZ
Here is the rule in question from PCBexpress web site: Solder mask swell is at least .008 larger than copper surfaces to keep mask off pads. Am I interpreting that correctly? That I need .008 all around the copper pad? Or is a mask .008 wider than the pad sufficient? -dave Dave N6NZ wrot

gEDA-user: bending design rules for TSSOP20 -- need advice

2006-10-21 Thread Dave N6NZ
Thought I just saw a thread on this topic, but I deleted the whole works and can't find it in the archives. I'm trying to reconcile a data sheet for a TSSOP-20, 0.65mm lead pitch package with PCBexpress's design rules. The problem: 26mil l.p. and 10mil pad width leaves 16mil btw pads. The ru