On Fri, 16 Jun 2017 15:01:08 +0100 Luke Kenneth Casson Leighton <l...@lkcl.net> wrote: > On Fri, Jun 16, 2017 at 2:59 PM, Neil Jansen <njans...@gmail.com> wrote: > > I'm on mobile at work, I've confirmed with an EE here that does this > > sort of thing all the time. > > > > The good news is that your easiest bet is to just ask the board house > > to fill the vias with epoxy, > > awesome. that's two great ideas. via-over-pad (which involves > resin-filling as well). > > l.
How about a third? I'm no EE (I'd like to be, but that's another story), so take this with a grain of salt. Use kapton tape to cover the holes. That will resist the heat the down and up side being that you have to manually apply and remove it afterwards and it will not leave a trace like epoxy so you can use the VIA holes. Sincerely, David _______________________________________________ arm-netbook mailing list arm-netbook@lists.phcomp.co.uk http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to arm-netb...@files.phcomp.co.uk
