Pertti Kellomäki <[email protected]> wrote: > Otherwise, I guess I need to learn to deal with the centre pad. > I gather it is mainly a heat sink, so does placing some vias > under the component and soldering from the other side work?
It's only present on the smallest packages available. On those packages, it's merely a mechanical fixture rather than a heat sink, because the standard pads on those small packages cannot take up too much mechanical force. Unless you're really that space constrained so you need MLF packages, just go ahead with a plenty of TQFP-packaged AVRs, or even DIP monsters if you prefer. ;-) -- cheers, J"org .-.-. --... ...-- -.. . DL8DTL http://www.sax.de/~joerg/ NIC: JW11-RIPE Never trust an operating system you don't have sources for. ;-) _______________________________________________ AVR-chat mailing list [email protected] http://lists.nongnu.org/mailman/listinfo/avr-chat
