Try this http://rel.intersil.com/docs/rel/calculation_of_semiconductor_failure_rates.pdf
You might also look for MIL-HDBK-217 Of course, a paper by H.S. Blanks makes the following statement: Although the temperature dependence of failure rate can be very high, in most situations it is much less than that of the Arrhenius acceleration factor. It is very improbable that the temperature dependence of component failure rate can be meaningfully modelled for reliability prediction purposes or for the purpose of optimizing thermal design component layout. (from abstract for "Arrhenius and the temperature dependence of non-constant failure rate" Quality and Reliability Engineering International, Vol 6, #4, pp259-265, 20 Mar 2007) You might also browse around http://www.weibull.com/ or http://www.klabs.org/ Jim From: [email protected] [mailto:[email protected]] On Behalf Of Jon Tegner Sent: Wednesday, April 14, 2010 1:12 AM To: Mark Hahn Cc: [email protected] Subject: Re: Re: [Beowulf] 96 cores in silent and small enclosure the max temp spec is not some arbitrary knob that the chip vendors choose out of spiteful anti-green-ness. I wouldn't be surprised to see some **************************************************************** Issue is not the temp spec of current cpus, problem is that it is hard to get relevant information. I haven't found any that states that the failure rate in year 5 should be significantly higher if you operate the cpu at 65 C instead of 55 C. I'm just saying this kind of information would be valuable (and I would be glad to find it). _______________________________________________ Beowulf mailing list, [email protected] sponsored by Penguin Computing To change your subscription (digest mode or unsubscribe) visit http://www.beowulf.org/mailman/listinfo/beowulf
