> The original "Flip Chip" was a packaging failure. It was literally a die > bonded to a PCB > and never went into production. > > I think it is mentioned in "Computer Engineering" > > IBM perfected the techniques to do this later with the development of solder > bumps and > IR reflow.
Are you talking about the little black rectangles, sort of SIP packages, DEC tried in the late 1960s? They were a disaster with reliability, but they did ship. -- Will
