Hi,
I have 2 quick questions about capacity issues when using PA-MC-T3 cards and the ability to do MLPPP. We currently have 5 PA-MC-T3 cards in a 7507/RSP8 chassis and I would like to be able to move onto either a higher capacity chassis or split things between two chassis. If we go the route of multiple chassis, I would need something like a M313 MUX that could take 6 or more DS3 circuits in and re-map them to different channels on DS3 ports coming out to the different chassis. This is due to the MLPPP needs and multiple carriers these circuits are coming from. If we go with a larger capacity chassis, I am thinking of changing over to OC3c circuits from the carriers to ensure that we would not have capacity issues down the road. So my questions are, A. What would be the recommended M313 MUX for this in the case of split chassis? B. Going with a larger capacity chassis, what would be recommended for doing this via OC3c handoffs or would it be better to stay with CT3 ports? Thanks. -Troy _______________________________________________ cisco-nsp mailing list [email protected] https://puck.nether.net/mailman/listinfo/cisco-nsp archive at http://puck.nether.net/pipermail/cisco-nsp/
