Original Sender : "Firza N. E." <[EMAIL PROTECTED]>
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Thursday, February 04, 1999, ���bud��� wrote:
> ternyata (meniup udara ke HS/CPU) lebih mendinginkan hetsink.
> apalagi kalo make kipas yang lebih gede dan diberi thermal paste
> diantara HS dan prosesor.
Thermal Paste ini, apakah seperti lem? Bersifat lengket?
Komputer saya, saya coba lepas pengungkit penahan HS-nya, lalu saya
coba cabut, tampaknya tidaknya.
Apakah karena lem? Atau karena dikasih thermal Paste ini?
Best regards,
Firza mailto:[EMAIL PROTECTED]
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