Hi Stephen, > -----Original Message----- > From: dev [mailto:dev-bounces at dpdk.org] On Behalf Of Stephen > Hemminger > Sent: Friday, December 4, 2015 5:14 PM > To: Doherty, Declan <declan.doherty at intel.com> > Cc: dev at dpdk.org > Subject: [dpdk-dev] [PATCH 0/8] bonding: fixes and enhancements > > These are bug fixes and some small enhancements to allow bonding to work > with external control (teamd). Please consider integrating these into DPDK > 2.2 > > Eric Kinzie (8): > bond: use existing enslaved device queues > bond mode 4: copy entire config structure > bond mode 4: do not ignore multicast > bond mode 4: allow external state machine > bond: active slaves with no primary > bond: handle slaves with fewer queues than bonding device > bond: per-slave intermediate rx ring > bond: do not activate slave twice > > app/test/test_link_bonding_mode4.c | 7 +- > drivers/net/bonding/rte_eth_bond_8023ad.c | 174 > +++++++++++++++++ > drivers/net/bonding/rte_eth_bond_8023ad.h | 44 +++++ > drivers/net/bonding/rte_eth_bond_8023ad_private.h | 2 + > drivers/net/bonding/rte_eth_bond_api.c | 48 ++++- > drivers/net/bonding/rte_eth_bond_pmd.c | 217 > ++++++++++++++++++---- > drivers/net/bonding/rte_eth_bond_private.h | 9 +- > drivers/net/bonding/rte_eth_bond_version.map | 6 + > 8 files changed, 462 insertions(+), 45 deletions(-) > > -- > 2.1.4
Patches 6 and 7 of this patchset do not apply successfully to DPDK 2.2, a rebase is probably needed. It might be better to split this patchset into a fixes patchset and a new feature patchset. Regards, Bernard.