On Tue, 2008-08-12 at 22:46 +0200, thomasg wrote: > Btw. - this telit chipsets look really nice. > E.g. HSDPA 7.2 Mbit in about the same dimensions (only thicker) then > the mc75i, datasheets available: > http://www.telit.com/en/products/umts-hsdpa.php?p_id=14&p_ac=show&p=13 > Maye to be considered for a future device?
the UC864-G might be more interesting, as it does everything http://www.telit.com/en/products/umts-hsdpa.php?p_id=14&p_ac=show&p=14 > On Tue, Aug 12, 2008 at 10:09 PM, Patryk Szymczak > <[EMAIL PROTECTED]> wrote: > > The dimensions it states is, that it's a 35x35x3.5mm package > (a announcement > > about the MC75i said, that it's using the same package) - > compared to the > > current 2-chip solution from TI (10x10 + 7x7) this takes up > at least 6 times > > the space. > > > Uhm, not possible. Telit GE864 is probably one of the smallest > possible modules with its 30 x 30 x 2.8 mm. > http://www.telit.com/en/products/gsm-gprs.php?p_id=12&p_ac=show&p=11 > > -- > ---------------------------------------------- > Patryk Szymczak > mobile: +48 695759817 > > > _______________________________________________ > devel mailing list > [email protected] > https://lists.openmoko.org/mailman/listinfo/devel > > > > _______________________________________________ > devel mailing list > [email protected] > https://lists.openmoko.org/mailman/listinfo/devel _______________________________________________ devel mailing list [email protected] https://lists.openmoko.org/mailman/listinfo/devel
