Yes via must be included. the problem here is, that the holes shoudent. and also the board needs to be exported. and if the board is a sandwich of different materials, it could be interesting to export the dielectric layers as many opjects. but for now i think copper, via's and board should be enough. for the Dk, thats a parameter You normally set in the simulator, when You assign materials to the objects.
On Monday, April 8, 2024 at 1:57:35 AM UTC+2 Subaru Arai wrote: > Just for notice, if you want for EM simulation I think we'll also need > vias and substrate properties too. > Then again, I'm not too familiar with the process of EM simulation. (what > kind of file does it need for input, what are the standard file formats) > > I've also heard that above 5ghz the substrate (typically FR-4) weaving (or > its direction, inconsistency) itself can be a problem - although I guess > that's calculated inside the simulator. > 2024年4月7日日曜日 5:58:17 UTC+9 [email protected]: > >> I would vote for the layer-list >> >> On Friday, April 5, 2024 at 12:29:36 PM UTC-6 [email protected] wrote: >> >>> i would like to be able to export all copper layers (not only top and >>> bottom), to import it in a EM-simulator. >>> >>> it seems to be not to hard to implement, because the top and bottom >>> layers can be exported via an option. my question now is: should we simply >>> add an option "export any copper"? or would it be better to make a >>> layer-list to specify what should be exported? >>> >>> and then i would like to know, how the export-dialog is made. is there a >>> "dialog-designer" or is it all coded? >>> >>> thanks >>> >> -- You received this message because you are subscribed to the Google Groups "KiCad Developers" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To view this discussion on the web visit https://groups.google.com/a/kicad.org/d/msgid/devlist/a5fe238e-85c3-4fc5-8a61-38b7f8060ef3n%40kicad.org.
