While researching 74xxx1G components for M1, I made a comparison chart for the corresponding SMT packages. It shows the package names according to TI and NXP, then the package dimensions, pin pitch, number of contacts, any other attributes.
Packages with compatible footprints are separated from incompatible ones by a blank line. 1.45|1.75x2.75|3.05 means 1.45-1.75 mm wide, 2.75-3.05 mm deep. To construct the component's part number, use SN74fff1Gggppp for TI, 74fff1Gggnn, where fff is the logic family (e.g., AUP), gg is the type of gate (e.g., 00 for NAND, 08 for AND, etc.), ppp is TI's package code (DVB, DCK, ...), and nn is NXP's package code (GW, GM, etc.) The file below lives in http://projects.qi-hardware.com/index.php/p/wernermisc/source/tree/master/pkgology/1g-dyadic Some SMT packages used for 74xxx1G devices (5-6 contacts) Package name Width x Depth Lead to Lead Pitch Leads/Pkg TI DBV 1.45|1.75x2.75|3.05 2.6|3.00 0.95 5 TI DCK 1.10|1.40x1.85|2.25 1.8|2.40 0.65 5 NXP GW/SOT353-1 1.15|1.35x1.85|2.25 2.0|2.25 0.65 5 TI DRL 1.50|1.70x1.10|1.30 1.50|1.70 0.50 5 TI DRY 0.95|1.05x1.40|1.50 0.50 6 NL NXP GM/SOT886 0.95|1.05x1.40|1.50 0.50 6 NL TI DSF 0.95|1.05x0.95|1.05 0.35 6 NL NXP GF/SOT891 0.95|1.05x0.95|1.05 0.35 6 NL NXP GS/SOT1115 0.85|0.95x0.85|0.95 0.55 6 NL NXP GN/SOT1202 0.95|1.05x0.95|1.05 0.55 6 NL TI YZP 0.85|0.95x1.35|1.45 0.50 5 BGA TI YFP 0.74|0.80x1.14|1.20 0.40 6 BGA Pkg: NL = no lead (contacts may be accessible with a narrow probe) BGA = contacts inaccessible Sources: http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf http://focus.ti.com/lit/ds/symlink/sn74aup1g08.pdf - Werner _______________________________________________ Qi Hardware Discussion List Mail to list (members only): [email protected] Subscribe or Unsubscribe: http://lists.en.qi-hardware.com/mailman/listinfo/discussion
