> On Jun 20, 2016, at 5:58 PM, Jordan Justen <jordan.l.jus...@intel.com> wrote:
> 
> On 2016-06-20 17:08:58, Kinney, Michael D wrote:
>> Jordan,
>> 
>> There is a "Driver" directory in the proposal and the types of 
>> components you refer to would go into packages under "Driver".
>> 
>> An OS does not need to initialize the CPU/Chipset/Memory/SoC
>> from reset.  These are actions that are either done by HW
>> or firmware, which is why I am proposing a different top level
>> directory for modules that perform this basic init actions.
>> 
>> What name do you suggest as an alternative to Silicon.
> 
> Driver. I don't see an important reason to create a separate area for
> these driver packages. It just appears to be causing us to invent some
> new term, when driver works better.
> 
> I thought we should just make a single DriverPkg, and put all the
> drivers under that.
> 

Drivers, you mean like taxi drivers, and truck drivers :).

It kind of seems like Mike is making a PI Drivers bucket and a UEFI Drivers 
bucket. From an OS perspective most things work more like an UEFI driver. I'm 
not sure if using the PI and UEFI tags are going to help or hurt. Maybe 
PlatformDriverPkg and UefiDriverPkg? Not trying to say that is right, but I 
wanted to keep the conversation moving. 

Thanks,

Andrew Fish

> -Jordan
> 
>> 
>>> -----Original Message-----
>>> From: Justen, Jordan L
>>> Sent: Monday, June 20, 2016 4:55 PM
>>> To: Mudusuru, Giri P <giri.p.mudus...@intel.com>; Kinney, Michael D
>>> <michael.d.kin...@intel.com>; edk2-devel@lists.01.org; Kinney, Michael D
>>> <michael.d.kin...@intel.com>
>>> Cc: Mudusuru, Giri P <giri.p.mudus...@intel.com>
>>> Subject: RE: [edk2] [RFC V2] Proposal to organize packages into directories
>>> 
>>> On 2016-06-17 15:58:38, Mudusuru, Giri P wrote:
>>>> Thanks Mike. My preference is Silicon as it is generic and
>>>> represents broadly CPU/Memory/Chipset/SoC etc...
>>>> 
>>> 
>>> I believe Silicon can be used to manufacture other items as well. And,
>>> it is possible to manufacture electronics without it being based on
>>> Silicon.
>>> 
>>> I prefer how Linux just has a drivers directory with functional areas
>>> split under there:
>>> 
>>> https://git.kernel.org/cgit/linux/kernel/git/torvalds/linux.git/tree/drivers
>>> 
>>> -Jordan
>>> 
>>>> 
>>>>> -----Original Message-----
>>>>> From: edk2-devel [mailto:edk2-devel-boun...@lists.01.org] On Behalf Of
>>>>> Kinney, Michael D
>>>>> Sent: Friday, June 17, 2016 10:50 AM
>>>>> To: Justen, Jordan L <jordan.l.jus...@intel.com>; edk2-devel@lists.01.org;
>>>>> Kinney, Michael D <michael.d.kin...@intel.com>
>>>>> Subject: Re: [edk2] [RFC V2] Proposal to organize packages into 
>>>>> directories
>>>>> 
>>>>> Hi Jordan,
>>>>> 
>>>>> Yes.  Many terms were considered other than Silicon, except Carbon :)
>>>>> 
>>>>> None of the terms we have considered are a perfect match.
>>>>> 
>>>>> We are wanting to keep modules for controllers attached to I/O subsystems
>>>>> and modules for peripherals separate from modules that perform basic
>>>>> CPU/Memory/Chipset/SoC init.
>>>>> 
>>>>> Is there any preference on the list between Silicon, Chip, or Device
>>>>> or other names for basic CPU/Memory/Chipset/SoC init?
>>>>> 
>>>>> Thanks,
>>>>> 
>>>>> Mike
>>>>> 
>>>>> 
>>>>>> -----Original Message-----
>>>>>> From: edk2-devel [mailto:edk2-devel-boun...@lists.01.org] On Behalf Of
>>>>> Jordan Justen
>>>>>> Sent: Wednesday, June 1, 2016 1:07 PM
>>>>>> To: Kinney, Michael D <michael.d.kin...@intel.com>; edk2-
>>>>> de...@lists.01.org; Kinney,
>>>>>> Michael D <michael.d.kin...@intel.com>
>>>>>> Subject: Re: [edk2] [RFC V2] Proposal to organize packages into 
>>>>>> directories
>>>>>> 
>>>>>> On 2016-05-25 19:03:38, Kinney, Michael D wrote:
>>>>>>> # Top Level Directory Structure (Listed Alphabetically)
>>>>>>> ```
>>>>>>> edk2
>>>>>>>  Application       Applications and application support libraries
>>>>>>>  BaseTools         EDK II build tools/scripts
>>>>>>>  Conf              EDK II build configuration files
>>>>>>>  Core              Platform agnostic packages for core FW services
>>>>>>>  Deprecated        Packages that will be removed from edk2/master soon
>>>>>>>  Driver            EDK II Drivers (no platform assumptions)
>>>>>>>    <Package1>      Non-Vendor specific EDK II drivers
>>>>>>>    <Package2>      Non-Vendor specific EDK II drivers
>>>>>>>    . . .
>>>>>>>    Vendor          Vendor specific EDK II drivers
>>>>>>>      <VendorA>
>>>>>>>      <VendorB>
>>>>>>>  Platform          Platforms used to validate edk2/master features
>>>>>>>    Common          Non-vendor specific platform packages
>>>>>>>    Emulated        Non-vendor specific emulated platform packages
>>>>>>>    Arm             ARM specific platform packages
>>>>>>>    Intel           Intel specific platform packages
>>>>>>>    <VendorM>       <VendorM> specific platform packages
>>>>>>>    <VendorN>       <VendorN> specific platform packages
>>>>>>>  Silicon           CPU/Chipset/SoC packages
>>>>>> 
>>>>>> Were any other terms considered? Chip, Device?
>>>>>> 
>>>>>> Carbon? ;)
>>>>>> 
>>>>>> -Jordan
>>>>>> 
>>>>>>>    Common          Non-vendor specific CPU/Chipset/SoC drivers
>>>>>>>    Arm             Arm specific CPU/Chipset/SoC drivers
>>>>>>>    Intel           Intel specific CPU/Chipset/SoC drivers
>>>>>>>    <VendorX>       <VendorX> specific CPU/Chipset/SoC drivers
>>>>>>>    <VendorY>       <VendorY> specific CPU/Chipset/SoC drivers
>>>>>>> ```
>>>>>>> 
>>>>>> _______________________________________________
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