Kev,
While full failure analysis is a nice thing to do, it often takes
significant lab equipment to fully analyze the failure point - and
increases the time to repair (and cost to the customer).
With dense SMD boards, the problem of failure analysis is compounded
exponentially. It is not feasible in all cases to give a 'cause and
effect' analysis. The best the technician can do in a reasonable amount
of time is to venture a WAG (wild a** guess).
73,
Don W3FPR
On 8/15/2016 8:39 PM, Kevin - K4VD wrote:
It always seems slightly less than satisfying to be told what broke but not
how it might have broke. I always think back to the Navy six step
troubleshooting method drilled into me in ET "A" school. The final step was
always failure analysis.
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