Ron D'Eau Claire wrote:
I wrote, "Lead-free solder melts at a higher temperature than leaded
solder. Higher temperatures mean it's easier
to lift a trace or damage a solder pad if you change a part."
This is certainly true. But it's worse than that. What I should have
said is that it's much harder to get parts off the board *at all* if
they were secured using unleaded solder. It's hard to get even one wire
out of a hole!
In 1999 I wrote about the joys of component removal:
http://www.kkn.net/archives/html/QRP-L/1999-01/msg00445.html
Everything I said in this piece goes double for lead-free solder :)
However, I must modify my original Technique #8. Rather than use a
component lead to clean out a solder-filled hole, I use a very thin
stainless-steel "pick" or a toothpick. The solder won't stick to such
tools -- a huge improvement over my original method.
73,
Wayne
N6KR
---
http://www.elecraft.com
_______________________________________________
Elecraft mailing list
Post to: Elecraft@mailman.qth.net
You must be a subscriber to post to the list.
Subscriber Info (Addr. Change, sub, unsub etc.):
http://mailman.qth.net/mailman/listinfo/elecraft
Help: http://mailman.qth.net/subscribers.htm
Elecraft web page: http://www.elecraft.com
