There are different methods used to solder SMT components to PC boards. The use of adhesive under the body of the component is an older process typically used for wave soldering. Reflow soldering is more common now (especially for single sided boards), where the solder paste is screened onto the board first and then the component leads are placed into the paste. The sticky paste holds the component in place until the solder melts, at which point the surface tension of the solder takes over.
I'm pretty sure the K3 uses the latter technique and wouldn't have any epoxy holding the resistor to the board. 73, Dave AB7E ------Original Mail------ From: "Brian Alsop" <als...@nc.rr.com> To: <elecraft@mailman.qth.net> Sent: Fri, 29 Jan 2010 21:40:33 +0000 Subject: [Elecraft] K3 F Gain mod The instructions have you clipping one SMT resistor and then removing the pieces. I've did a trial of this method on a junk PCB here. At least on the board I used, there apparently is some kind of adhesive under under the chip. The clipping process seems to remove the solder resist and perhaps any PCB traces under the chip. Is there anything under R8 that can be damaged? (Guess not, since nobody complaining. A blow up of the pix doesn't seem to show anything either) 73 de Brian/K3KO ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:Elecraft@mailman.qth.net This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:Elecraft@mailman.qth.net This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html
