I read in !emc-pstc that Chris Chileshe <chris.chile...@ultronics.com>
wrote (in <01c26f7a.00510c40.chris.chile...@ultronics.com>) about
'Testing for dry joints' on Wed, 9 Oct 2002:

>The specific problem is that the joints appear to be electrically 
>sound to start with, meaning the units are getting through function 
>test, but once exposed to endurance (lengthy)  tests or worse 
>still, actual practical use, the gremlins begin to show. The fault 
>analysis almost invariably leads to a connector dry joint.

Can you please provide more information:

- do these joints involve gold-plated parts?

- do the endurance tests and use involve vibration?

Gold plated parts can cause bad joints through the development of a non-
conducting interface between the solder and the metal that was gold-
plated before the plating dissolved in the solder. Such bad joints are
extremely difficult to find, because the fault is hidden inside a
perfectly formed solder pad.

The remedy is usually to increase the soldering temperature, but a
change of flux may also be necessary.

Failure due to vibration produces a characteristic grey, almost micro-
crystalline appearance of the solder pad. 

The remedy is self-evident, but may be difficult to implement.

I know a way of detecting some types of *potential* bad joint, using an
audio-frequency non-linearity test. It can be very sensitive, but
obviously I don't know whether it would work in your case.
-- 
Regards, John Woodgate, OOO - Own Opinions Only. http://www.jmwa.demon.co.uk 
Interested in professional sound reinforcement and distribution? Then go to 
http://www.isce.org.uk
PLEASE do NOT copy news posts to me by E-MAIL!

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