Sudhakar,
Take a look at industry standards. As I remember from my years I spent in the
semiconductor
industry, JEDEC standards were among those used to evaluate chips.
John Radomski
Schneider Automation
"Chris Maxwell"
<chris.maxwell@NETTES To:
<[email protected]>, <[email protected]>
T.COM> cc:
Sent by: Subject: RE: ESD HBM
contact pad to pad testing.
owner-emc-pstc@LISTSE
RV.IEEE.ORG
05/06/2005 05:04 PM
Pat,
I was watching this thread curiously…since it seems that Sudhakar’s question
deals more with an
ESD test at chip level as opposed to testing a product. One initial response
mentioned EN
61000-4-2. I wasn’t satisfied with that, because EN 61000-4-2 is meant to
test products, as
opposed to chips (my understanding anyway). Pointing to the ESD association,
as you did was a
good idea.
I seem to recall that ANSI may have some chip level ESD guidance?
Sorry that I can’t be of more assistance, as I deal with “products” where I
work, not chips.
So, EN 61000-4-2 is the standard that I’m familiar with…which means that, in
this case, the
only thing I’m good for is pointing out its shortcomings.
Chris Maxwell
Design Engineer
Nettest
From: [email protected]
[mailto:[email protected]] On Behalf Of
[email protected]
Sent: Friday, May 06, 2005 4:05 PM
To: [email protected]
Subject: RE: ESD HBM contact pad to pad testing.
Sudhakar:
The ESD test standard EN61000-4-2 uses a 150pF/330ohm C-R combination, and is
referred to as
the HMM model. This will give much higher peak current than the HBM you
mention.
Take a look at http://www.ce-mag.com/archive/03/03/henry.html.
The ESD Association references several different standards. This might be a
good place to
start:
http://www.esda.org/standards.html
Pat
"Anchondo, Dan"
<[email protected]> To: "Sudhakar Wasnik"
Sent by: <[email protected]>,
<[email protected]>
[email protected] cc:
Subject: RE: ESD HBM
contact pad to
pad testing.
05/06/2005 11:43 AM
Sudhakar
You might want to look at EN 61000-4-2 because this may be your
methodology and relevant standard. I don't sell ESD generators but do a
search for ESD guns with the spec number (EN 61000-4-2) and you should
get a model to perform this type of testing. Make sure you get the
right probes with ESD gun.
Regards
Dan Anchondo
From: [email protected]
[mailto:[email protected]] On Behalf Of Sudhakar Wasnik
Sent: Friday, May 06, 2005 11:15 AM
To: [email protected]
Subject: ESD HBM contact pad to pad testing.
Dear gurus of Regulatory compliance world.
We make memory cards like SD, Mini SD Transflash. We are
required to comply with +/-4KV HBM ( 100pF/1500 Ohm) contact pad ( Pad
to Pad) per SD Association specification.
Does any one knows about this pad to pad testing @ product
level ( Card)?
I am more interested in test instrumentation, methodology and
relevant standard.
I will appreciate any help on this.
Sudhakar Wasnik
[email protected]
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