Hello all ESD experts,
Per IEC 6100-4-2 Sec. 7.1.1 EUT is isolated from HCP (Horizontal Coupling Plane) by insulating object of 0.5mm thick. Standard does not define this Insulating object. Based on the different insulating materials the test results vary. Pass can be fail and fail can be passing. This is more relevant in memory cards like SD, CF Micro SD etc. These cards need to be tested in non operating condition. Just keeping it on the test table separated from the HCP with this IEC insulating object. Can some one really throw some light on this insulating object and intent of this test from the standards view? Sudhakar Wasnik. 408-542-2928 - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
