At least in MIL-STD-461 and RTCA/DO-160 of which I have personal knowledge,
the EUT must be bonded to the ground plane in the same manner it would in
its intended installation.  I assume other standards do likewise, but the
point is that any sort of LISN provides a standard source impedance
specifically based on a controlled bonding impedance (NTE) whereas the test
sample performance depends on its specific grounding/boning configuration,
which the test set-up must replicate to the maximum extent possible.

Ken Javor
Phone: (256) 650-5261


> From: John Woodgate <j...@jmwa.demon.co.uk>
> Reply-To: John Woodgate <j...@jmwa.demon.co.uk>
> Date: Fri, 13 Mar 2015 14:47:28 +0000
> To: <EMC-PSTC@LISTSERV.IEEE.ORG>
> Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI
> C63.4
> 
> In message <d1285ee5.69ff8%ken.ja...@emccompliance.com>, dated Fri, 13
> Mar 2015, Ken Javor <ken.ja...@emccompliance.com> writes:
> 
>> A ground plane made of copper, brass or aluminum of any extent (width
>> as well as length) will have microohms of resistance
> 
> I wonder if that's always true when you take into account the contact
> between the EUT and the ground plane, not just the ground plane itself.
> -- 
> OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
> When I turn my back on the sun, it's to look for a rainbow
> John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK
> 
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