http://benchmarkreviews.com/index.php?option=com_content&task=view&id=150&Itemid=62&limit=1&limitstart=0

On Thu, Nov 4, 2010 at 8:30 AM, george monroe <geomonro...@gmail.com> wrote:

> http://skinneelabs.com/tim-v2.html
>
>
> On Thu, Nov 4, 2010 at 7:59 AM, george monroe <geomonro...@gmail.com>wrote:
>
>> from what i have read, it seems most compounds are close to each other in
>> abilities. the thing i noticed was the different schools of thought on the
>> amount to use. i personally am sticking with the thought that the paste is
>> to fill in any voids on the surface of the chip and heatsink, i dont put a
>> thick layer on. i am also pretty confident that as long as we only use a
>> small amount, the idea of seepage, is that a word, will not be a problem and
>> if a minute amount seeps off the surface of the chip it will not cause
>> damage. i also avoid any metalic containing paste just to be sure.
>>
>>
>> On Thu, Nov 4, 2010 at 12:16 AM, Tina K. <penguir...@gmail.com> wrote:
>>
>>> On 2010/11/03 12:39, John Carmonne so eloquently wrote:
>>>
>>>>
>>>> I have noticed that Apple used a thick paste on the G4 PowerBooks, I
>>>> assume this is because the possible flexing and ambient temperature
>>>> changes of the components could break the thermal contact
>>>>
>>>
>>> That might not be the case, I do remember some Apple model being
>>> manufactured with too much thermal paste by mistake, but I don't remember
>>> which model it was.
>>>
>>>
>>> Tina
>>>
>>> --
>>>
>>> iMac 20" USB 2 1.25GHz G4 2GB RAM GeForce FX 5200 Ultra 64MB DDR
>>> Gnome/Ubuntu 10.10
>>>
>>> Power Mac June 04 2GHz G5DP 8GB RAM GeForce 6800 Ultra DDL 256MB Leopard
>>> 10.5.8
>>>
>>> PowerBook G4 15" HiRes DLSD 1.67GHz G4 2GB RAM Radeon 9700 128MB DDR
>>> Leopard 10.5.8
>>>
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>>
>>
>

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