> 1- Add buried/blind vias That would require a file format change. Please discuss the new format with us before you start, as that's likely to affect your changes. There's also been a little discussion about being able to set pad/via annulus sizes and clearances separately for inner, top, and bottom layers. It might be a natural thing to combine that with blind/buried via support.
Plus, you might want to wait a week or so, we're just about to start migrating the HID project into the official CVS repository; most of the code will change and you wouldn't want to have to redo your work. > 2- on a relatively longer term basis, will try to make a > translator or inteface to opensource tools for EMI, transmission > line and delays analysis (such as MMTL, wcalc, GLMoM for EM > analysis,...). We are trying to design a desktop & mobile > motherboard using PCB (for commercial use), and we will see if can > adapt any missing functions as we proceed. Might want to use HID exporters for these. > We have used before major PCB tools from the leading companies, > and I think PCB is a piece of cake when it comes to ease of use, > and I believe its source cose is relatively easy to follow > (compared to other EDA codes I have seen!) And HID is supposed to make it *easier* to follow :-)
