On 9/6/06, Craig Niederberger <[EMAIL PROTECTED]> wrote:
2. In a linear array of pins, say one side of a DIP or a single row header, given a hole diameter H and an interpin distance D (commonly 0.1 inch or 2 mm, but could be others,) are there any good suggestions for formulas for thickness T, mask M and clearance C?
I have the beginnings of a footprint design guide at http://www.luciani.org/not-quite-ready/doc/fp.pdf When determining guidelines for copper width, pad spacing, etc. you should survey the process capabilities of the PCB houses that you are considering. For DIPs and headers (100mil or 2mm centers) I usually size the PADs to allow and 8mil trace with 8mil spacing. (* jcl *) -- http://www.luciani.org _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
