Hi,
I would prefer naming a footprint like footprintname_technology.fp For example MSSOP28W_R.fp which means MSSOP28W soldered by reflow technology. Other technologies may could apply like wave soldering (W), hand soldering (H). andrewm <[EMAIL PROTECTED]> wrote: > John Luciani wrote: >> On 9/1/07, andrewm <[EMAIL PROTECTED]> wrote: >> >>> I am presently drawing up footprints for my stock components. >>> >>> I have read the naming conventions for the footprints and have >>> done some searches but can't find an answer to this query. >>> >>> I have for many components two different foot prints. I would >>> like to know if there is a convention to naming the multiples. >>> >>> I don't mean I have a device that comes in a DIP40 and also >>> comes in a TQFP44. I mean I wish to have two version of a >>> MSSOP28W (0.65mm 28 lead 5.3mm wide package) >>> footprint. >>> >>> I would like one version of the footprint following the >>> manufacturer approved pin width/length. I would also like >>> another version with longer pins that I use in prototype >>> boards that I will hand solder. >>> >> >> If you followed a manufacturer's specification I would use a suffix >> that calls out the specific manufacturer and package >> designation (e.g. "__TI_DRC_Package") >> >> IPC-7351 calls out an environment use suffix which you could probably use >> for designating larger prototype pads. The "Most Material" condition >> may work for >> your prototype fooprints and the "Nominal Material" for a production process. >> >> M ... Most Material >> N ... Nominal Material >> L ... Least Material >> >> I am thinking of adding the suffixes "MM", "NM", "LM" to my naming convention >> to correspond to the IPC-7351 material conditions. >> >> (* jcl *) >> >> > > Thanks John, > > However the extra meat I put on some pads for prototype soldering is > well in excess of the IPC-7351 most material. > > I think I will just pop a suffix on the back of them for my own use and > I shall never release the footprints to not confuse others. > > > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > -- Levente http://web.interware.hu/lekovacs _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user