ditto... 1) Placement and power distribution placement includes minimizing ratsnest lines crossing each other and clustering power requirements then figure out how to distribute the power
2) Escape from under the BGA's take bga traces out from under to a bit beyond the edge. again keep in mind unwinding the rat nest crosses. 3) plan the use of your signal layers. dedicate layers to running north/south and other layers to east/west. 4) run the buses they are all going from the same place to one or more other places and just like being run together 5) run the short traces this is often already done under buses 6) run the rest anyway you can Steve Meier On Fri, 2008-05-16 at 11:12 -0400, DJ Delorie wrote: > I route power, ground, and bypass caps first. Then any critical > traces, like crystals or switchers. Then busses if there's an obvious > pattern to them (like my m32c RAM array). Then I let PCB have a go at > it and see what it screws up, and route those next, etc. > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user