Csanyi Pal wrote: > Hello, > > I find the following on the Internet and want to ask you what do you > think about it: > > Experimentation with Solder Paste and a Toaster Oven > > http://images.google.com/imgres?imgurl=http://www.curiousinventor.com/images/guides/smt/oven_paste_and_other_equip.jpg&imgrefurl=http://www.curiousinventor.com/guides/Surface_Mount_Soldering/Solder_Paste_and_Toaster_Oven&usg=__XIgiZVSYOAq1lUbMhok3ABEhPk8=&h=463&w=600&sz=92&hl=hu&start=62&sig2=_IRzNnfPckWp25fVUftNyg&um=1&tbnid=osu6-oViQITc1M:&tbnh=104&tbnw=135&ei=8I2ySb6MGsec_gbSzrHDBA&prev=/images%3Fq%3Dhow%2Bto%2Buse%2Bpaste%2Bflux%26ndsp%3D21%26hl%3Dhu%26client%3Diceweasel-a%26rls%3Dorg.debian:hu-HU:unofficial%26sa%3DN%26start%3D42%26um%3D1 > > I'd say he's making the job a lot harder than it needs to be. If you want to know what works well, look at what prototyping people do in industry. They use a soldering iron for most things. The use of solder cream is pretty much limited to robot assembly, as you can silk screen it onto the board.
Some kind of oven approach might work for BGAs, but on that page doesn't show any of those being used. The high temperature you need right under the package makes temperature control for BGA soldering tough. Steve _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user