I am trying to make the correct name for my LFBGA320 footprint I have some questions:
What is the differences between: * Ball Grid Array’s * BGA w/Dual Pitch * BGA w/Staggered Pins * Collapsing or Non-collapsing Balls and how can I figure out what type of BGA component I have? The footprint and device info can be found here: https://secure.powercraft.nl/svn/openarm/trunk/doc/CPU/LPC3180FEL320/ (use http://www.cacert.org/ for root ca authority) The IPC naming conventions tells me I need to use the following format: Ball Grid Array’s: BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height https://secure.powercraft.nl/svn/openarm/trunk/working/pcb/documents/IPC-7351ANamingConvention.pdf Can somebody help me? I am gambling the following: BGA-320N-50P-4X4_1300x1300x90.fp LFBGA320: plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm SOT824-1 If somebody can check the footprint and name on errors I would be very thankful this is the first time I am working with BGA's. Best regards, Jelle de Jong _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user