How about we move this thread back to its original topic of blind and buried vias, not arguments regarding whether or not PCB is part of gEDA.
I have some questions out of plain curiosity: completely aside from the question of how they ought to be handled by GNU PCB or any other PCB design tool, I wonder how these blind/buried vias work at a more basic level: 1. How are blind/buried vias made physically? I thought they glued the layers together first, then drilled the holes. 2. How are they represented in the Gerber+drill file set that passes from the PCB design tool to the fab? I'm asking out of plain curiosity - I hope that I never have to make a board with such vias as I've heard that they add a bit of sadomasochistic flavor to board bringup/debug efforts - but then I guess some boards are so cramped for space that you can't avoid them... MS _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
