I don't know about burn-in specs, but one usually specifies a glass temperature (Tg) and a destruction temperature (Td) for the PCB material you want to use (typically FR-4). I don't recall the nominal Td and Tg we used to use, but I do know they is now higher due to the RoHS directives.
A quick Google search suggests that IPC-4101 provies specifications which might be what you are looking for. Cheers, Stuart On Wed, 14 Oct 2009, Ellec, Chris wrote: > > Can somebody recommends burn in spec. for PCB such as time vs. > temperature? Is there a mil spec for that? I could only find mil-spec > for burning in individual IC, not PCB (mil-std-883 for example). > > Thanks, > > Chris. > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user