To the Developers -
Gentlemen - is there any forward prospect of increasing the number
of working layers (I am talking metal, as opposed to solder mask, paste,
silk, etc...) ? The current eight layers is great - don't get me wrong,
but I am looking at some work with very dense FPGAs that would make a
few more (12?) more convenient.
I thank you for your hard work and wish you the best in the
Christmas holidays!
Cheers!
Tony Radice
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