I sent off some Gerber files from pcb today for fabrication and discovered no easy way to generate solder paste Gerbers with reduced-size apertures for things like the exposed die-attach pads on QFN packages. (There's a Freescale app note at [1]http://cache.freescale.com/files/sensors/doc/app_note/AN3111.pdf describing some of the issues which can result from too much paste.) I've developed a patch for pcb which adds a new "shrinkpaste" flag for pads. Setting this flag on a pad causes the pad to be changed to a square pad with an area of 40% of the original pad area during stencil-layer rendering. If anyone else would find this patch useful (or if I missed something really obvious), please let me know... -Andrew -- Andrew Armenia Ultradian Diagnostics LLC Rensselaer, NY 12144 [2]www.ultradian.com
References 1. http://cache.freescale.com/files/sensors/doc/app_note/AN3111.pdf 2. http://www.ultradian.com/
_______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user