I have two questions relating to solder paste. One is more general, second one is about gEDA/PCB. 1.) Is it common practice to add paste on top of a copper layer to carry more current or to remove heat from small power devices (surface mount SOT26 buck regulator in my case)? If so, do all PCB houses support it, does it bring an extra cost, and does it have any pitfalls? I know I have seen extra silvery "paste" (if it can be called that) in some power supplies on the bottom of the board, but I'm not sure if this is part of the PCB assembly process or not (perhaps it is added later, after the PCBs are made.) 2.) Is it possible to add extra paste in PCB? I tried adding a "paste" and "frontpaste" layer but it just created a signal8 gerber; I'd like it to combine the paste layer with the internally generated one (for the pads and drilled holes.) Many thanks, Tom
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