On Sun, Mar 05, 2006 at 03:09:55PM -0800, Steve Meier wrote: > Well I don't expect it to explode ;) And, I think we have already > established that all electronics related technical questions are > exceptable debate foder for this list. So drop the appology and tell us > afterwards what your experiences were. > > The issue, I think, is can you solder the lead free device to a board > with a lead based solder and make a good conduct? > > I suspect the answer is yes. If it doesn't seem to work use some more > flux. Inspect the solder conection in the typical method looking for > cold solder joints. > > Lead free seems to indicate that the device not only doesn't contain any > significant lead but that it also can withstand the higher temperatures > that lead free solders require. So if you can get a lead based solder to > adhear to the devices pins then the lower solder temperature shouldn't > be a problem to the device. If the device is in a solder ball based > package such as a BGA then you might have to cook the board with the > device at a higher temperature in order to get it connected. If this is > the case and you are including older devices on the same board then the > increased temperature might damage the older devices. In this case a > stratagy of cooking the board with just the non-lead parts first then > attaching and re-cooking the board with the lead based parts might be > the right idea. > > This issue of visual inspection for cold solder joints is going to be > more complex with non-lead based solder. This is do to all solder joints > looking shiny (as i recall from the seminar I attended) even if they are > bad with the silver tn based solders.
For me with Sn99Cu1 the joint look always matte, no matter if they are good or bad. CL<