It could take two layers to do this - One layer to mask-out the default paste and a second layer to
put in what you want. But I don't think many are using it at all so just reversing the function
might be a simple useful fix.
Right now the solder-paste layer adds area's to put solder paste on - not exactly useful. What is
most often needed is a way to reduce the solder-paste under parts that want to 'float-away'.
(In my old notes - this layer WAS called solder-paste-mask - which suggests it was to 'mask'
solder-paste - probably what it should do.)
To understand why this is needed - look at pg-12 of
http://www.nxp.com/documents/data_sheet/PBSS8110X.pdf
The right way is to use less paste under some areas. I can't think of a need to add paste - just a
need to mask it out - so it could be done with one layer - but the layer that is used in the stable
release is applied as an addition, not a mask.
If the solder-paste layer could be subtracted from the solder-paste gerber that is generated from
the pads, it would solve this problem easily.
--
--------------------------------------------------------------------------------
Karl Schmidt EMail k...@xtronics.com
Transtronics, Inc. WEB
http://secure.transtronics.com
3209 West 9th Street Ph (785) 841-3089
Lawrence, KS 66049 FAX (785) 841-0434
Truth is mighty and will prevail.
There is nothing wrong with this,
except that it ain't so.
--Mark Twain
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