On 3/23/2015 3:25 PM, Simon Richter wrote: > Hi, > > Am 23.03.2015 um 18:56 schrieb Chris Pavlina: > >> KiCad does not currently support standalone vias, and I think that would >> be a necessity before a *clean* implementation of this could be done.
This would have to be done first and it would require changes to the file format, zone definition and filling, and the DRC at a minimum. There are probably some other things I'm forgetting. JP would have a better idea of the effort involved. Once this part is complete, then we could start discussing tools for using standalone vias. That being said, I also think this is something useful to have but as Chris eluded to it will not happen until after the next stable release. > > I think these vias would be placed inside a copper pour, so there is > something to "connect" them to. The notion of "generated" vias is new > though (so if I change parameters for thermal relief, these vias can be > deleted and recreated). > > I'd like to tack a feature request on top of that: thermal via > generation in pads. For my last project I simply used four rectangular > pads with copper on top and bottom and a hole in the middle. This works, > but for library submission I'd like to be able to express this in a > cleaner way (i.e. one large pad, with an attribute how much thermal > power it needs to sink). > > Simon > > > > _______________________________________________ > Mailing list: https://launchpad.net/~kicad-developers > Post to : kicad-developers@lists.launchpad.net > Unsubscribe : https://launchpad.net/~kicad-developers > More help : https://help.launchpad.net/ListHelp > _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : kicad-developers@lists.launchpad.net Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
