On 2017-11-06 09:01 AM, Oliver Walters wrote:
To provide an option to reduce the size of the 3D model library, I have implemented an "array" feature for 3D models. A module (footprint) can reference a single model multiple times, with a dimensional offset between each copy.

Sounds interesting. This would be quite useful for IC packages (both through hole and surface mount) in addition to male and female headers.

And I forgot to add in my previous message it is also good for IC sockets.

--
Cheers!

Kevin.

http://www.ve3syb.ca/           |"Nerds make the shiny things that distract
Owner of Elecraft K2 #2172      | the mouth-breathers, and that's why we're
                                | powerful!"
#include <disclaimer/favourite> |             --Chris Hardwick

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