Alain M. a écrit : > > Hi Jean Pierre, > > I also found a problem in the new version with Zone fill: > > I needed a pad to be round on one side and right-angled on the other > side. To do that, I ploted an ARC on the solder-side. This makes an > extra copper area exactly as I need. The only problem is that Zone-Fill > is ignoring that extra copper area and is making a short :( (I could > workaround using the zone clearence) > > Do you need a sample file? If I send only the .brd file, is it ok? > Yes, send me your board file.
-- Jean-Pierre CHARRAS Maître de conférences Directeur d'études 2ieme année. Génie Electrique et Informatique Industrielle 2 Institut Universitaire de Technologie 1 de Grenoble BP 67, 38402 St Martin d'Heres Cedex Recherche : Grenoble Image Parole Signal Automatique (GIPSA - INPG) Grenoble France
