missing out the via pads (annulars) on the inner pcb layers is very unusual, and I don't think Kicad can do it for that reason.
Not sure what you mean about non-SMT BGA footprints. You need the solder mask for BGA packages to keep the solder from flowing along the tracks away from the BGA balls (unless all your tracks are on inner layers). Get the latest version of Kicad from here: http://kicad.sourceforge.net/wiki/index.php/Main_Page Nick. --- In [email protected], "pwintulich" <pe...@...> wrote: > > Hello, > > I have a small 6 layer PCB with 2 BGA parts (Both 0.8mm pitch). > I noticed the Vias have Anulars on all layers rather than just the ones with > trace connections. > > Are there any options to set the layers without trace connection to be drill > and clearence only? > Alternatly has any one written a utility to adjust the gerbers? > The main reason for this is to get a good power feed in under the BGA parts. > I am most interested in applying the change to my power and ground planes. > > My BGA pads are NSMT (Non-Solder Mask Defined) defined at the moment. Has > anyone produced SMT (Solder Mask Defined) BGA footprints? If so what method > was used. > > I think am currently running windows version 20090225-final. I have not found > where to check for added features for newer version of KiCad. > > Regards Peter Wintulich >
