I have never had any problems using the build in auto router that kicad comes with.
Except now that I am working with a mixed board (SMD and through the hole) with some chips that have very thin leads (74VHC164MTC 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4 mm wide) The routing is not completing, before I was getting errors related to "pad to pad" clearance, I adjusted ERC parameters, but it still can not finish the board. Is this too complex for the build in auto router? Do I need to adjust other ERC parameters to make this work?
