Use Intelligent Power Allocation (IPA) technical to add dynamic power model for binding CPU thermal zone. The power allocator governor allocates power budget to control CPU temperature.
Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature. Binging document is refer to this patchset https://lkml.org/lkml/2015/11/17/251 Change since V1: 1. Include mt8171.h and sort header file for mt8173.dtsi Change since V2: 1. Move dynamic/static power model in device tree Change since V3: 1. Remove static power model. 2. Split V3's device tree in two for thermal zones and dynamic power models respectively. Dawei Chien (3): arm64: dts: mt8173: Add thermal zone node for mt8173 platform. arm64: dts: mt8173: Add dynamic power node for mt8173 platform. thermal: mediatek: Add cpu dynamic power cooling model. arch/arm64/boot/dts/mediatek/mt8173.dtsi | 47 ++++++++++++++++++++++++++++++ drivers/cpufreq/mt8173-cpufreq.c | 28 +++++++++++++----- 2 files changed, 67 insertions(+), 8 deletions(-) -- 1.7.9.5 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
