On 15/03/2021 04:07, Viresh Kumar wrote: > On 12-03-21, 18:03, Daniel Lezcano wrote: >> Currently the naming of a cooling device is just a cooling technique >> followed by a number. When there are multiple cooling devices using >> the same technique, it is impossible to clearly identify the related >> device as this one is just a number. >> >> For instance: >> >> thermal-idle-0 >> thermal-idle-1 >> thermal-idle-2 >> thermal-idle-3 >> etc ... >> >> The 'thermal' prefix is redundant with the subsystem namespace. This >> patch removes the 'thermal prefix and changes the number by the device >> name. So the naming above becomes: >> >> idle-cpu0 >> idle-cpu1 >> idle-cpu2 >> idle-cpu3 >> etc ... >> >> Signed-off-by: Daniel Lezcano <daniel.lezc...@linaro.org> >> Reviewed-by: Lukasz Luba <lukasz.l...@arm.com> > > I acked for both the patches :(
Right, I'll add you when merging the patches. Thanks -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog
