On Tue, Jul 16, 2013 at 12:57:34PM -0700, Arjan van de Ven wrote: > then the question of how much remaining capacity; this is a hard one, and not > just > for Intel. Almost all mobile devices today are thermally constrained, ARM and > Intel > alike (at least the higher performance ones)... the curse of wanting very > thin and light > phones that are made of thermally isolating plastic (so that radio waves can > go through) > and have a nice and bright screen...
Right, so we might need to track a !idle avg over the thermal domain to guestimate the head-room and inter-cpu relations. But yeah, I suppose what I've been saying is that we need to drag cpufreq into the SMP era. Only considering a single cpu isn't going to work anymore. -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
