those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.
Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.
For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).
Signed-off-by: Felipe Balbi <ba...@ti.com>
---
drivers/usb/musb/Kconfig | 2 ++
1 file changed, 2 insertions(+)
diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig
index dfb57f2..0f1d3e0 100644
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -39,10 +39,12 @@ choice
config USB_MUSB_DAVINCI
tristate "DaVinci"
depends on ARCH_DAVINCI_DMx
+ depends on BROKEN
config USB_MUSB_DA8XX
tristate "DA8xx/OMAP-L1x"
depends on ARCH_DAVINCI_DA8XX
+ depends on BROKEN
config USB_MUSB_TUSB6010
tristate "TUSB6010"
--
1.8.1.rc1.5.g7e0651a
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