On Fri 23 Nov 2012 11:56:24 NZDT +1300, C. Falconer wrote: > So I need someone with the equipment to reflow (remelt) or reball
Reflow ovens take whole PCBs, and need their temperature profile set up. Not a 5 minute job!! You also don't want to stick the whole PCB in if you can avoid it. Next best: Use a paint-stripping heat gun or similar, pro equipment is not really any different. Heat up just the IC in question. Temperature control is difficult, and you'll almost certainly exceed the manufacturer's spec for max time at high temp. Max temp is usually 260�C. Heat up slowy, and as evenly as you can, until the solder melts. You don't really have much of a choice. BGAs are not for repair. They are not repairable. Shield surrounding PCB areas with tinfoil taped securely in place (tape NOT near the sodler action...). Your imagination as to how to find out when the solder melts is as good as anyone's. The PCBs are not a repair job, they're a replace job. > (remove the solder, clean and resolder) the IC. BGAs with solder balls under the case are by definition a once-use, twice-throwaway. You need to replace the cheap with a fresh one with new solder balls. Basically, forget it. Since there's nothing to lose, try technique above, and don't expect success. Volker -- Volker Kuhlmann http://volker.dnsalias.net/ Please do not CC list postings to me. _______________________________________________ Linux-users mailing list [email protected] http://lists.canterbury.ac.nz/mailman/listinfo/linux-users
